-
1 solder down
-
2 solder down
-
3 settle down
успокоиться глагол:поселиться (settle, settle down, fix oneself in a place, take up one's residence, make one's home, take up one's abode)успокаиваться (calm down, quiet, settle down, quiet down, quieten, settle)угомониться (calm down, settle down, settle)образумиться (settle, settle down) -
4 settle
урегулировать имя существительное: глагол:поселиться (settle, settle Down, fix oneself in a place, take up one's residence, make one's home, take up one's abode)располагаться (settle, encamp)расселяться (settle, separate)поселяться (settle, colonize, locate)отстаиваться (settle, cream)успокаиваться (calm down, quiet, settle down, quiet down, quieten, settle)усаживаться (sit down, settle, sit oneself)образумиться (settle, settle down)колонизировать (colonize, settle)угомониться (calm down, settle down, settle) -
5 steady
устойчивый имя прилагательное: наречие: глагол:делать прочным (steady, set)делать устойчивым (steady, stabilize)придавать устойчивость (steady, ballast)делаться твердым (harden, indurate, solidify, steady)имя существительное: -
6 come to an anchor
стать на якорь глагол: -
7 technique
1) метод, способ; (технологический) приём2) технология3) техника; профессиональные приёмы и навыки; мастерство•- alloying technique
- angle-lap technique
- anti-aliasing technique
- back-reflection Berg-Barrett technique
- backscatter technique
- ball alloy technique
- base-emitter self-aligning technique
- batch technique
- batch-fabrication technique
- Bayesian technique
- beam lead technique
- bias-compensation technique
- Bitter technique
- black-write technique
- boat-in-solder technique
- Borrman anomalous-transmission technique
- breadth-first search technique
- bristle block technique
- brute force technique
- bubble rocking technique
- CCM techniques
- chemical-transport technique
- chemical vapor infiltration technique
- closed-tube technique
- cold-cathode technique
- cold crucible technique
- collapse technique
- counter-countermeasures techniques
- crucibleless technique
- cryogenic technique
- cryptographic techniques
- crystal-pulling technique
- crystal pushing technique
- Czochralski technique
- dark-field technique
- data storage techniques
- decoration technique
- depth-first search technique
- dialog debug technique
- diffraction Berg-Barrett technique
- digital adaptive technique for efficient communications
- diversity technique
- dot-and-dash technique
- double-diffusion technique
- double-diffusion fabrication technique
- double-doping technique
- electroless technique
- electron-beam probe technique
- electron-beam resist technique
- enumerative technique
- epi technique
- epitaxial technique
- estimation technique
- face-down technique
- fine-line technique
- flame-fusion technique
- flip-chip technique
- floating-crucible technique
- floating-zone technique
- float-zoning technique
- folded spectrum technique
- frequency hopping technique
- gas-doping technique
- gradient technique
- graphical evaluation and review technique
- grown-junction technique
- half-select technique
- harmonic mixer technique
- hollow-cathode technique
- holographic technique
- horizontal pulling technique
- horizontal crystal pulling technique
- hot-and-cold load technique
- hot-pressing technique
- incremental time technique
- integrated technique
- interface-alloy technique
- interference technique
- inverted-mesa processing technique
- inverted mounted technique
- ion-implantation technique
- iterative technique
- jet-etching technique
- jet-solder technique
- Kruger-Finke technique
- lenticular color technique
- macrocell technique
- masking technique
- mason-jar technique
- meltback technique
- melt-quench technique
- mesa technique
- microalloy technique
- microelectronic technique
- microstrip technique
- microwave technique
- modified digital adaptive technique for efficient communications
- Monte-Carlo technique
- moving-mask technique
- multijunction epitaxial technique
- multimicrophone technique
- multiple-access technique
- multiple-color-filters technique
- multiplexer technique
- near-field technique
- normal-freezing technique
- one-probe technique
- one-way scheduling technique
- open-tube technique
- optical heterodyne technique
- pedestal technique
- photolithographic technique
- photoprocessing technique
- piston-crucible technique
- planar-epitaxial technique
- post-alloy-diffusion technique
- powder-pattern technique
- printed-circuit technique
- program evaluation and review technique
- programmed growth rate technique
- proton guard-ring implant technique
- pulse technique
- pulse-alloying technique
- pyrolitic-deposition technique
- RAD technique
- rapid application development technique
- salami technique
- scaling technique
- scan-in, scan-out technique
- schlieren technique
- sequential weight increasing factor technique
- silk-screening technique
- simulation technique
- simultaneous iterative reconstruction technique
- single-mask technique
- slip-mat fast-start technique
- solder-ball technique
- solder-reflow technique
- solder transfer application technique
- solid-state technique
- solution-regrowth technique
- solvent-evaporation technique
- spread-spectrum technique
- sputtering technique
- strain-annealed technique
- structured analysis and design technique
- subtractive color technique
- surface-melting technique
- template matching technique
- testing technique
- thermal-gradient technique
- thermal-wave technique
- thermocompression technique
- thick-film technique
- thin-film technique
- transmission Berg-Barrett technique
- two-turntable quick-start technique
- vacuum-deposition technique
- vacuum-evaporation technique
- vapor-plating technique
- Verneuil technique
- vertical pulling technique
- vertical crystal pulling technique
- wave soldering technique
- weight-counting technique
- white-write technique
- zone-leveling technique
- zone-melting technique -
8 bond
1) связь; соединение; сцепление || связывать; соединять; сцеплять2) присоединение || присоединять3) связующее ( вещество), связующий материал, связка; крепитель ( вещество)5) строит. антисейсмический пояс6) строп7) электрическое соединение; сращивание проводов10) электрон. выполнять (прикрепление) соединение пайкой или сваркой11) швейн. дублированное (клеевое) соединение•to break ( to fail in) bond — нарушать сцепление-
acceptor bond
-
adhesive bond
-
American bond
-
angle bond
-
atomic bond
-
available bond
-
ball bond
-
basket-weave bond
-
block bond
-
block-in-course bond
-
brick bond
-
bridge bond
-
cable bond
-
carbon-coke bond
-
ceramic bond
-
chain bond
-
chemisorptive bond
-
chimney bond
-
cohesive bond
-
common bond
-
concrete bond
-
conductor bond
-
continuity-rail bond
-
covalent bond
-
cross bond
-
cross-linking bond
-
cross-rail bond
-
dangling bond
-
diagonal bond
-
die bond
-
dipolar bond
-
donor bond
-
double bond
-
Dutch bond
-
energy rich bond
-
English bond
-
English cross bond
-
English garden-wall bond
-
eutectic bond
-
face-down bond
-
face bond
-
Flemish bond
-
frictional bond
-
glassy bond
-
gold bond
-
header bond
-
herringbone bond
-
heteropolar bond
-
high-energy bond
-
homeopolar bond
-
hoop iron bond
-
ice bond
-
impedance bond with secondary winding
-
impedance bond
-
interfacial bond
-
intertrack-rail bond
-
ionic bond
-
ion bond
-
mechanical bond
-
molecular bond
-
nail-head bond
-
ornamental bond
-
oven-wall bond
-
pattern bond
-
planar bonds
-
point bond
-
punch-driven bond
-
quadruple bond
-
quarrystone bond
-
quetta bond
-
rail bond
-
raking bond
-
random bond
-
ranging bond
-
rattrap bond
-
reactance bond
-
refractory bond
-
rope-rail bond
-
running bond
-
sand bond
-
scissile bond
-
Scotch bond
-
semipolar bond
-
silver bond
-
silver-lock bond
-
single bond
-
solder bond
-
solderless bond
-
steel welded bond
-
stitch bond
-
stone bond
-
stretcher bond
-
tar bond
-
track bond
-
traction rail bond
-
triple bond
-
valence bond
-
vulcanization bond
-
wedge bond
-
wire bond
-
wire-rail bond -
9 lead
I1) опережение || опережать2) строит. порядовка; маяк ( в каменных работах)3) мн. ч. направляющие стрелы копра4) направляющие блоки или рамки каната ( для перетаскивания брёвен)5) шаг (винта, резьбы)6) длина хода ( поршня)9) ж.-д. длина стрелочного перевода10) ж.-д. стрелочная горловина12) ввод; вывод13) мн. ч. соединительные провода, "концы"14) мн. ч. ошиновка15) опережение по фазе || опережать по фазе16) упреждение; угол упреждения18) интерлиньяж, междустрочный пробел•-II
addressing lead
-
axial lead
-
beam lead
-
bonding lead
-
bond lead
-
brush lead
-
bus lead
-
cantilevered lead
-
compliant lead
-
connecting lead
-
current lead
-
down lead
-
earth lead
-
extension lead
-
flexible lead
-
flying lead
-
gold-plated lead
-
ground lead
-
guide lead
-
heater lead
-
hub lead
-
hump lead
-
input lead
-
inside lead
-
internally wired leads
-
jump lead
-
jumper lead
-
load leads
-
main lead
-
neutral lead
-
oil lead
-
phase lead
-
radial lead
-
resilient lead
-
ribbon lead
-
shielded lead
-
shoulderless lead
-
shunt leads
-
side-brazed lead
-
socket lead
-
solder-dipped lead
-
spider lead
-
spud lead
-
support lead
-
taper lead
-
terminal lead
-
tin-plated lead
-
track relay lead
-
web lead
-
wire lead
-
zero lead1) свинец, Pb || освинцовывать, покрывать свинцом || свинцовый3) этилировать4) графит; карандашный грифель5) гарт, типографский сплав6) мн. ч. полигр. шпоны7) мор. лот8) грузило, отвес9) игольная плитка ( трикотажной машины)•-
alkyl lead
-
black lead
-
break-resistant lead
-
car-emitted lead
-
colored lead
-
color lead
-
compass lead
-
deep-sea lead
-
desilvered lead
-
die-cast lead
-
exhaust lead
-
fretted lead
-
graphite lead
-
mossy lead
-
needle lead
-
pencil lead
-
polymer lead
-
primary refined lead
-
red lead
-
refill lead
-
refined lead
-
retractable lead
-
secondary refined lead
-
sheet lead
-
slag lead
-
sounding lead
-
square lead
-
tetraethyl lead
-
white lead
-
window lead
-
yellow lead
-
zone-refined lead -
10 bonding
1) (при)соединение; прикрепление2) термокомпрессионная сварка, термокомпрессия3) соединение пайкой, пайка; соединение сваркой, сварка4) заземление (напр. аппаратуры)•- area array tape-automated bonding
- ball bonding
- batch bonding
- beam-lead bonding
- chip bonding
- coherent light bonding
- die bonding
- diffusion bonding
- epoxy bonding
- eutectic bonding
- explosive bonding
- face-down bonding
- face-up bonding
- flip-chip bonding
- friction bonding
- gang bonding
- impulse bonding
- laser bonding
- optical-contact bonding
- solder bonding
- spider bonding
- stitch bonding
- tape-automated bonding
- tape-automatic bonding
- TC bonding
- TC bird beak bonding
- thermal-compression bonding
- thermal-pulse bonding
- thermocompression bonding
- ultrasonic bonding
- wedge bonding
- wire bonding -
11 bonding
1) (при)соединение; прикрепление2) термокомпрессионная сварка, термокомпрессия3) соединение пайкой, пайка; соединение сваркой, сварка4) заземление (напр. аппаратуры)•- area array tape-automated bonding
- ball bonding
- batch bonding
- beam-lead bonding
- chip bonding
- coherent light bonding
- die bonding
- diffusion bonding
- epoxy bonding
- eutectic bonding
- explosive bonding
- face-down bonding
- face-up bonding
- flip-chip bonding
- friction bonding
- gang bonding
- impulse bonding
- laser bonding
- optical-contact bonding
- solder bonding
- spider bonding
- stitch bonding
- tape-automated bonding
- tape-automatic bonding
- TC bird beak bonding
- TC bonding
- thermal-compression bonding
- thermal-pulse bonding
- thermocompression bonding
- ultrasonic bonding
- wedge bonding
- wire bondingThe New English-Russian Dictionary of Radio-electronics > bonding
-
12 form
1) анкета; бланк2) вид; форма || придавать вид или форму3) контур; очертание4) конфигурация6) строит. опалубка; элемент опалубки7) скамейка, лавочка8) формуляр9) составлять; образовывать10) формироваться•calculation in a series form — матем. вычисление с помощью ряда
evaluation of indeterminate form — матем. раскрытие неопределённости
fraction in a factored form — матем. дробь в форме разложения на множители
in an expanded form — в виде ряда; в развёрнутом виде
integration in a closed form — матем. интегрирование в конечном виде
of closed form — матем. в конечном виде, с конечным числом членов
preparation of type form — полигр. чернение набора
reduction to a normal form — матем. приведение к нормальной форме
to bring into a canonical form — матем. приводить к канонической форме; приводить к каноническому виду
to form a circle — замыкаться в кольцо; образовывать кольцо
to rearrange in the form — переписывать в виде; преобразовывать к виду ( об уравнениях)
- absolutely convergent form - absolutely extreme form - definite form - elementary form - elimination form of inverse - everywhere regular form - evolutionary operation form - geodesic curvature form - indefinite form - p-adically equivalent form - relatively bounded form - repair request form - third fundamental form - totally definite form - totally discontinuous formto take on a form — принимать форму; принимать вид
См. также в других словарях:
Solder paste — (or solder cream) is used for connecting the terminations of the IC packages with that of land patterns on the PCB. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are… … Wikipedia
Solder — A solder is a fusible metal alloy with a melting point or melting range of 90 to 450 °C (200 to 840 °F), used in a process called soldering where it is melted to join metallic surfaces. It is especially useful in electronics and plumbing. Alloys… … Wikipedia
Microelectromechanical system oscillator — Microelectromechanical system (MEMS) oscillators are timing devices that generate highly stable reference frequencies. These reference frequencies are used to sequence electronic systems, manage data transfer, define radio frequencies, and… … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Lead poisoning — Classification and external resources An X ray demonstrating the characteristic finding of lead poisoning, dense metaphyseal lines. ICD 10 T … Wikipedia
Soldering iron — Infobox tool name = Soldering iron caption =A gas fired soldering iron other name =Soldering Gun classification = Metal joining types = related = Brazing WeldingA soldering iron is a device for applying heat to melt solder for attaching two metal … Wikipedia
Automated optical inspection — (AOI) is an automated visual inspection of a wide range of products, such as printed circuit boards (PCBs), LCDs, transistors, automotive parts, lids and labels on product packages or agricultural products (seed corn or fruits). In case of PCB… … Wikipedia
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
